| i-NEXIV VMR6555(Wide Stage Envelopment Platform) |
 |
| Feature |
- ´ëÇÐ, ±â¾÷¿¬±¸¼Ò, °¢±Þ¿¬±¸±â°ü µîÀÇ ºÐ¼®, ¿¬±¸¿ë
- MEMS,³ª³ëÇÁ¸°ÅÍ,¹ÝµµÃ¼,LCD,±Ý¼Ó ºÎǰ µî
- Digital Imaging&Multi-sensing metrology ½Å°³³ä CNC Video Çö¹Ì°æ
|
| Ultrahigh-Precision Measurement Paltform |
- X,Y,Z travel 650x550x150mm
- Sub-micrometer level uncertainty (U1xy 0.6§+2L/1000§,U2xy 0.9§+3L/1000§)
- Type 1,2,3 Models
- 650x550mm stage stroke perfect for PCBs
- Automatic measurement of batches of parts by placing
multiple piecestogether on the stage
- Laser AF achieves high-accuracy measurements of bump
heights
- Laser AF also enables measurements of height variance
and warping in workpieces
- Search function enables measurements of lans and holes of PCBs
- Serach function provides accurate measurements even
when workpieces are not properly located on the stage | |

 |
| TTL(Thru-The-Lens)Laser AF |
- High Speed&Accurate Focusing enabling precise-Z
axis measurements
- Co-Axial Laser Unit for easy operation
- 50mm Working Distance for Dynamic Height
Measurement
- Trigger Focus Mode for Height Gap Measurement
- Laser Scan Mode for Z axis form analysis
| |
| Application |
- Semiconductor packages, Subss, Stampled parts, Connectors and small parts, Clock parts
| 
| Z120X Model(with Maximum Magnification Module) |
120X optical magnification enables measurements of fine line widths High-precision TTL Lase AF features high NA and enables measurements of small height gaps Perfect for measurement of high- density, finely-machined workpieces Optional Bird's Eye View software plots MEMS parts in 3D format Ideal for small high-density PCBs, Small precision dies and models, packages(2D+height), MEMS parts |
| LU Model(Universal epi-illuminator/motorized nosepiece) |
Full range of Nikon CFI60 LU microscope objectives from 5X to 150X Supports brightfield, darkfield, DIC, simple polarizing applications Motorized quintuple universal nosepiece Easy to use software controls all functions of the system Ideal for small-size LDCs, organic EL panels, 8"(200mm) wafers |
| VMR AutoMeasure Standard Provider software | 

| I NEXIV VMR-6555/Z120X/LU |
Stroke(XxYxZ)
|
Optical Head for Type 1,2,3 LU model |
650x550x150mm |
| LU model |
25.6x21.7x5.9in |
With max.magnification module (high mag.lens) |
650x550x150mm 25.6x21.7x5.9in |
With max.magnification module (low mag.lens) |
600x550x150mm 23.6x21.7x5.9in |
| Minimum readout |
0.1§ |
| Maximum workpiece weight |
30kg(44.0lb) |
| Measuring uncertainty |
1.5+2.5L/1000§ (workpiece max.30kg) |
2.5+2.5L/1000§ (workpiece max.30kg) |
| Z-axis(L:Length in mm<W.D) |
1.5+L/150§ Note:Z-axis accuracy is guaranteed by Laser |
| Camera |
B&W 1/3-in CCD(progressive scan),color 1/3-in CCD |
| Working distance |
Optical Head for Type 1,2,3 |
50mm |
| With max.magnification module |
High mag.objective lens:9.8mm Low mag.objective lens:32mm) |
| LU model |
Refer to C FI Objective Lenses for LCD |
| Magnification vs field view |
Optical Head for Type 1 |
0.5-7.5X/9.33x 7-0.622x0.467mm |
| Optical Head for Type 2 |
1-15X/4.67 x 3.5-0.311x0.233mm |
| Optical Head for Type 3 |
2-30X/2.33x1.75-0.155x0.117mm |
With max. magnification module
|
1-120X/4.67 x 3.5-0.039x0.029mm |
| Auto focus |
TTI Laser AF and Vision AF,LU model:Vision AF only |
| Illumination |
Optical Head for Type 1,2,3
|
Diascopic epscopic,8-segment LED ring illumination(inner ring/outer ring) |
| With max.magnification module |
Episcopic, diascopic(with high mag.head only),darkfield illumination |
| LU model |
Diascopic, Episcopacy&Darkfield illumination |
| Power source |
AC100-240V¡¾10%,50/60Hz |
| Power consumption |
Max.13A(Standard type) 15A(Z120X type) |
| Dimensions&weight |
Main unit only |
|
| Main unit&table |
1220x1680x1750mm approx.600kg (48.0x66.1x68.9in,1322.8lb) |
| Controller |
250x550x500mm,approx,31kg(9.8x21.7x19.7in,68.3lb) |
Footprint
|
2400(W)x2000(D)mm (94.5x78.7in) |
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